Abstract WC-Co cutting tools are widely used by the metalworking industry. In order to improve the properties of these tools, research on the application of wear-resistant coatings, such as polycrystalline diamond, are of great importance to several applications. It is known that the occurrence of high-stress levels between the coating and the substrate can lead to adhesion failures. One strategy to minimize these failures is applying an intermediate layer of SiC. In this work, the deposition of a SiC layer was carried out by a novel two-step laser cladding approach. Instead of cladding directly the pre-synthesized SiC on the substrates, a 200 µm silicon powder layer was pre-deposited on the WC-Co substrates and then irradiated with a 30 W CO2 laser. To improve metallurgical bonding between the tungsten and the Si layer, all substrates were chemically attacked. This attack allows cobalt removal from the surface and increases surface roughness, improving the laser cladding process. After the SiC laser cladding, samples were coated with a 200 µm graphite powder layer and irradiated again by a CO2 laser. The samples were characterized by SEM, EDS, and XRD analysis. The results showed that in the first step, an irradiation energy of about 0.27 J was enough to fuse the silicon powder to the substrate and in the second step, 0.13 J was enough to promote the reaction between silicon, carbon and the WC substrate, resulting in the in-situ synthesis of SiC. Finally, a new method was proposed for the deposition of SiC on WC-Co based substrates and the observed results allowed the proposal of an empirical equation to describe the chemical reactions of the process.

The objective of this work is to study the possibility of obtaining dense parts using water atomized AISI 316L steel powder in the L-PBF process. Despite its irregular, non-spherical, particle morphology, it has a significantly lower cost. 25 samples were produced varying the laser power and the scanning speeds to determine the optimal processing conditions. Additionally, hot isostatic pressing (HIP) was performed after the L-PBF process to further increase densification. Selected samples were subjected to microstructural characterization. The best densification results obtained were for the sample produced with the laser power of 173 W and scanning speed of 600 mm/s, where densifications close to 98% were obtained. HIP post-processing promoted increased densification of samples with closed porosity, allowing samples with densification above 95% to reach values close to 100%. HIP did not promote the closure of open pores. The results indicate that the use of water atomized AISI 316L in the L-PBF process combined with post-processing by HIP can produce dense engineering components and at the same time reduce the production costs of the manufactured components, mainly because it is a lower cost raw material when compared to the commonly used feedstock obtained by gas atomization.

Abstract The effect of temperature was investigated on the consolidation of blended elemental powders of aluminum and copper by equal channel angular pressing (ECAP). Aluminum and Copper powders (1:1% vol.) were blended and consolidated in a 90° ECAP die at room (RT) and cryogenic temperatures (CT - ~77 K). ECAP samples were pressed until 4 passes at room temperature in route Bc. As a reference, a sample was obtained by conventional uniaxial pressing. The obtained results indicated a much denser (>99.5%) and harder structure by cryogenic ECAP. The hardness after one pass at CT was comparable with 4 passes at room temperature. Tensile tests performed at CT for materials with similar chemical composition showed a simultaneous increase in strength and ductility at CT, corroborating the results obtained by ECAP. The partial suppression of dynamic recovery and the activation and the transition between deformation mechanisms at CT, as well as stacking fault energies (SFE) of such metals, played an important role in these results. Copper presented a much higher capability of strain hardening than aluminum, due to its lower SFE and much lower homologous temperature. X-ray diffraction indicated a strong correlation between the variation of average microstrain and the variation of hardness on both metals. The results of this study demonstrated the great potential of the application of very low temperatures for the obtaining of deformation metal-metal composites.

Equal channel angular pressing (ECAP) is one of the severe plastic deformation processes that can also be used for metallic powder consolidation. Consolidation of blended elemental powders of iron, chromium, nickel, and manganese (Fe-25Cr-20Ni-2Mn wt. %) was performed at room temperature in a Φ = 120° die by 1 and 2 passes. SEM micrographs indicated that single pass ECAP consolidated sample presented close to full densification. Additional pass of ECAP led to hardness increase and to an apparent better mixing between the different particles. SEM/EDX analysis made before and after heat treatment of the samples showed that effective diffusion only took place after heat treatment and especially in the sample subjected to 2 ECAP passes. Results indicate that alloying by ECAP consolidation and posterior heat treatment is feasible, especially for systems that cannot be processed by conventional means, as well as mechanical alloying.

A [211]-oriented niobium single crystal was deformed by equal channel angular pressing (ECAP) at room temperature using the route Bc to a total strain of 9.2. A sharp cube texture develops after ECAP processing. The deformed samples were annealed in vacuum from 400ºC (673 K) to 900ºC (1173 K) for 1 h to evaluate their microstructural stability. Scanning electron microscopy (SEM) was used to image the microstructures of as-deformed and annealed specimens. Electron backscatter diffraction (EBSD) was employed to determine the respective microtextures before and after annealing. Coarsening of the microstructure occurs at a maximum rate at 550ºC (823 K) due to discontinuous recrystallization. Normal grain growth replaces discontinuous recrystallization as the main coarsening mechanism above 700ºC (973 K).