Microstructure, structure and electrical and dielectric properties of ZnO-doped K0.5Na0.5NbO3 (KNN) ceramics were investigated. Powders were obtained by the conventional solid-state method. Samples doped with 0 to 1 mol% of ZnO were sintered at 1125 °C for 2 h. Through XRD spectra, the perovskite structure was detected, in addition to small peaks corresponding to secondary phases. It was also observed that zinc changed the microstructure and grain size of KNN ceramics. The addition of 0.5 mol% of Zn2+ produced a softening effect in the ferroelectric properties of the material, and increased its final density. Conversely, the addition of 1 mol% of Zn2+ reduced the sample densification.

In this paper the influence of Cu on dielectric and piezoelectric properties of K1/2Na1/2NbO3 (KNN) was evaluated. Samples were obtained by solid state reaction doping with CuO (0 to 2 mol%). The obtained samples were characterized by the Archimedes method, X-Ray diffraction, Raman spectroscopy, Scanning Electron Microscopy, polarization curves, piezoelectric constant (d33) and impedance spectroscopy at room temperature. In general, it was observed that doping does not improve dielectric and piezoelectric properties. Small amounts of CuO (0.5 mol%) slightly affected the densification process, while high concentrations increased the porosity of the samples. Also, low concentrations of CuO drastically reduced d33 values, presumably due to the hardening effect of the additive.

Con el objetivo de evaluar la influencia del Cu sobre las propiedades dieléctricas y piezoeléctricas del K1/2Na1/2NbO3 (KNN) se sintetizó, por reacción en estado sólido, KNN dopado con diferentes concentraciones de CuO (0 a 2% mol). El análisis del material se realizó empleando mediciones de densidad por el método de Arquímedes, difracción de rayos X (DRX), espectroscopía Raman, microscopía electrónica de barrido (SEM), curvas de polarización, constante piezoeléctrica (d33) y espectroscopía de impedancia a temperatura ambiente. En general, se observó que el aditivo no logró mejorar las propiedades dieléctricas o piezoeléctricas. Pequeñas cantidades de CuO (0,5%mol) afectaron ligeramente el proceso de densificación, mientras que altas concentraciones incrementaron la porosidad. Asimismo, bajas concentraciones de CuO redujeron drásticamente los valores de d33, presumiblemente debido al efecto endurecedor del aditivo.