The morphology and adhesion strength of the autocatalytic electroless nickel phosphorus (Ni-P) film, deposited at 40 ºC on polished alumina (Al2O3 99.6%) substrate, pretreated by sulfur/nitric solution, sensitizing with acid stannous chloride and activated using palladium chloride solutions, was studied using contact angle (CA), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), mechanical profilometer (DekTak), and direct laser writer (“maskless lithography”). The results showed that after treatment of the polished Al2O3 substrate, it presented a high performance in the electroless deposition of Ni-P thin-film at low temperature (40 ºC). It was obtained a more compact and continuous film, with small grain size and strong adherence. NiP Ni P (Ni-P film 4 AlO Al O (Al2O 99.6% 996 99 6 substrate sulfurnitric sulfur nitric solution solutions CA, CA , (CA) SEM, SEM (SEM) EDS, EDS (EDS) DekTak, DekTak (DekTak) maskless lithography. lithography . lithography”) Al2O thinfilm thin (4 ºC. ºC) adherence 99.6 9 (CA (SEM (EDS (DekTak lithography” ( 99.