The effect of the increase in crystalline defects in the structure generated by high-pressure torsion (HPT) on the corrosion behavior of metallic materials is not well understood. This report evaluates the influence of HPT on the corrosion behavior of a solution treated Al-3wt% Mg-0.2wt% Sc alloy in a 3.5 wt./v.% NaCl solution. The electrochemical behavior of the alloy was evaluated using cyclic polarization, electrochemical impedance spectroscopy (EIS), Mott Schottky, X-ray photoelectron spectroscopy, and chronoamperometry testing. The passive current density decreased after HPT processing, indicating a more protective oxide layer was formed on the surface of the HPT-processed alloy. Mott Schottky analysis confirmed the higher protection efficiency of the passive layer on the HPT-processed alloy. The film formed in the solution-treated alloy was a p-type and an n-type semiconductor while the alloy processed by HPT exhibited only an n-type semiconductor behavior. EIS showed that corrosion resistance in a saline medium increased with HPT processing.

An Al-3%Mg-0.2%Sc alloy was solution treated and subjected to 10 turns of high-pressure torsion (HPT). Thereafter, the HPT-processed material was annealed for 1 hour at temperatures ranging from 423 to 773 K and its mechanical properties and microstructural evolution were examined using microhardness measurements and EBSD analysis. The results demonstrate that the Al-Mg-Sc alloy exhibits an average microhardness of ~190 Hv and an average grain size of ~140 nm immediately after HPT processing and also after further annealing at 423 K. Conversely, it is shown that annealing at temperatures above 473 K leads to a substantial decrease in the hardness values as well as a sharp increase in the grain size of the material previously processed by HPT. In addition, detailed EBSD analysis revealed the formation of a bi-modal distribution of grains after annealing at temperatures from 623 to 773 K, and this becomes more uniform with increasing temperatures.